Copper Base Plate for IGBT Modules
Electroplating nickel aminosulfonate ensures good color brightness, low internal stress, and good ductility of the copper base plate. The surface effect of purple copper plate requires high standards.
Case Review
- Manufacturing process: T2Y2 copper, blanking, fine blanking
- Application: New energy electric vehicles, photovoltaic power semiconductor IGBT modules
- Stamping material: T2Y2 copper, hardness 80-100 HV
- Surface Finish: Nickel sulfamate plating
- Product features: No burrs, bright appearance, no scratches, no bumps, or indentations